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Size 50 - 100 Diamond Dicing Blades , Ceramic Chips Diamond Wafering Blade

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Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

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Size 50 - 100 Diamond Dicing Blades , Ceramic Chips Diamond Wafering Blade

Brand Name : HT

Model Number : HT-RB

Certification : ISO9001:2015&ISO16949

Place of Origin : Henan, China (Mainland)

MOQ : 2

Price : Price can be negotiated

Payment Terms : T/C,T/T

Supply Ability : 300/pcs per month

Delivery Time : 2-3weeks

Packaging Details : Carton Box

Type : Machine Blade

Blade Material : Diamond

Finishing : Other

Size : 58

Application : Semicoductor,Ceramic chips

Thickness : 0.25MM

Bond : Resin

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Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips

Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

Features:

1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.

2. Resin bonds are extremely flexible, therefore improving the surface finish quality.

Applications:

This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.

Specifications

Technical Parameters

O.D		Thickness			I.D
Size	Tolerance	Size	Standard tolerance	High precision tolerance	Size	Tolerance
50～ 100	+0.02	0.1~≤ 0.15	±0.005		25.4 30 31.75 40 60 80 88.9	+0.02~ 0

Product Tags:

precision diamond saw

disco dicing saw

Size 50 - 100 Diamond Dicing Blades , Ceramic Chips Diamond Wafering Blade Images

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